regarding the change of names mentioned in the document, such as mitsubishi electric and mitsubishi xx, to renesas technology corp. the semiconductor operations of hitachi and mitsubishi electric were transferred to renesas technology corporation on april 1st 2003. these operations include microcomputer, logic, analog and discrete devices, and memory chips other than drams (flash memory, srams etc.) accordingly, although mitsubishi electric, mitsubishi electric corporation, mitsubishi semiconductors, and other mitsubishi brand names are mentioned in the document, these names have in fact all been changed to renesas technology corp. thank you for your understanding. except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. note : mitsubishi electric will continue the business operations of high frequency & optical devices and power devices. renesas technology corp. customer support dept. april 1, 2003 to all our customers
feb.1999 v dss ................................................................................ 600v r ds (on) (max) ................................................................ 6.4 w i d ............................................................................................ 2a 600 30 2 6 60 C55 ~ +150 C55 ~ +150 2.0 v v a a w c c g FS2UM-12 v dss v gss i d i dm p d t ch t stg 10.5max. 4.5 1.3 f 3.6 3.2 16 12.5min. 3.8max. 1.0 0.8 2.54 2.54 4.5max. 0.5 2.6 7.0 qwe q gate w drain e source r drain r wr q e outline drawing dimensions in mm v gs = 0v v ds = 0v typical value symbol drain-source voltage gate-source voltage drain current drain current (pulsed) maximum power dissipation channel temperature storage temperature weight to-220 mitsubishi nch power mosfet FS2UM-12 high-speed switching use application smps, dc-dc converter, battery charger, power supply of printer, copier, hdd, fdd, tv, vcr, per- sonal computer etc. maximum ratings (tc = 25 c) parameter conditions ratings unit
feb.1999 mitsubishi nch power mosfet FS2UM-12 high-speed switching use v (br) dss v (br) gss i gss i dss v gs (th) r ds (on) v ds (on) ? y fs ? c iss c oss c rss t d (on) t r t d (off) t f v sd r th (ch-c) v v m a ma v w v s pf pf pf ns ns ns ns v c/w 600 30 2 0.8 3 5.0 5.0 1.3 300 30 5 13 10 30 30 1.5 10 1 4 6.4 6.4 2.0 2.08 i d = 1ma, v gs = 0v i g = 100 m a, v ds = 0v v gs = 25v, v ds = 0v v ds = 600v, v gs = 0v i d = 1ma, v ds = 10v i d = 1a, v gs = 10v i d = 1a, v gs = 10v i d = 1a, v ds = 10v v ds = 25v, v gs = 0v, f = 1mhz v dd = 200v, i d = 1a, v gs = 10v, r gen = r gs = 50 w i s = 1a, v gs = 0v channel to case 100 80 60 40 20 0 200150100500 10 1 7 5 3 2 10 0 7 5 3 2 10 ? 7 5 3 2 10 ? 23 5710 1 23 5710 2 23 5710 3 2 tw=10? 1ms 10ms 100? dc t c = 25? single pulse 2.0 1.6 1.2 0.8 0.4 0 0 4 8 12 16 20 6v 5v v gs =20v 10v 8v t c = 25? pulse test 5 4 3 2 1 0 0 1020304050 p d = 60w v gs = 20v 10v 8v 6v 5v t c = 25? pulse test power dissipation derating curve case temperature t c (?) power dissipation p d (w) maximum safe operating area drain-source voltage v ds (v) drain current i d (a) output characteristics (typical) drain current i d (a) drain-source voltage v ds (v) output characteristics (typical) drain current i d (a) drain-source voltage v ds (v) electrical characteristics (tch = 25 c) drain-source breakdown voltage gate-source breakdown voltage gate-source leakage current drain-source leakage current gate-source threshold voltage drain-source on-state resistance drain-source on-state voltage forward transfer admittance input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time source-drain voltage thermal resistance symbol unit parameter test conditions limits min. typ. max. performance curves
feb.1999 40 32 24 16 8 0 0 4 8 12 16 20 i d =3a t c =25? pulse test 2a 1a 10 8 6 4 2 0 0 4 8 12 16 20 t c = 25? v ds = 50v pulse test 10 1 7 5 3 2 10 ? 10 ? 23 5710 0 10 0 7 5 3 2 23 5710 1 t c = 25? v ds = 10v pulse test 125? 75? 23 5710 0 10 2 7 5 3 2 10 1 7 5 3 2 7 5 3 2 23 5710 1 23 5710 2 2 ciss tch=25? f=1mhz v gs =0v coss crss 23 5710 0 10 2 7 5 3 2 10 1 7 5 5 3 2 23 5710 1 10 ? tch = 25? v dd = 200v v gs = 10v r gen = r gs = 50 w t f t d(off) t r t d(on) 0 23 10 ? 5710 ? 23 5710 0 23 5710 1 10 8 6 4 2 t c =25? pulse test v gs =10v 20v on-state voltage vs. gate-source voltage (typical) gate-source voltage v gs (v) drain-source on-state voltage v ds (on) (v) on-state resistance vs. drain current (typical) drain current i d (a) drain-source on-state resistance r ds (on) ( w ) transfer characteristics (typical) gate-source voltage v gs (v) drain current i d (a) forward transfer admittance vs.drain current (typical) drain current i d (a) forward transfer admittance y fs (s) switching characteristics (typical) drain-source voltage v ds (v) capacitance vs. drain-source voltage (typical) drain current i d (a) capacitance ciss, coss, crss (pf) switching time (ns) mitsubishi nch power mosfet FS2UM-12 high-speed switching use
feb.1999 mitsubishi nch power mosfet FS2UM-12 high-speed switching use 5.0 4.0 3.0 2.0 1.0 0 ?0 0 5 0 100 150 v ds = 10v i d = 1ma 1.4 1.2 1.0 0.8 0.6 0.4 ?0 0 5 0 100 150 v gs = 0v i d = 1ma 10 0 7 5 3 2 10 ? ?0 10 1 7 5 3 2 0 5 0 100 150 v gs = 10v i d = 1/2i d pulse test 20 16 12 8 4 0 0 4 8 12 16 20 v ds = 100v 400v 200v tch = 25? i d = 2a 10 ? 10 1 7 5 3 2 10 0 7 5 3 2 10 ? 7 5 3 2 23 57 23 57 23 57 23 57 10 0 23 57 10 1 23 57 10 2 10 ? 10 ? 10 ? 10 ? p dm tw d= t tw t d=1 0.5 0.2 0.1 0.05 0.02 0.01 single pulse gate-source voltage vs.gate charge (typical) gate charge q g (nc) gate-source voltage v gs (v) source-drain diode forward characteristics (typical) source-drain voltage v sd (v) source current i s (a) channel temperature tch (?) drain-source on-state resistance r ds (on) (t?) threshold voltage vs. channel temperature (typical) gate-source threshold voltage v gs (th) (v) transient thermal impedance characteristics channel temperature tch (?) breakdown voltage vs. channel temperature (typical) pulse width t w (s) transient thermal impedance z th (ch?) (?/ w) on-state resistance vs. channel temperature (typical) drain-source on-state resistance r ds (on) (25?) channel temperature tch (?) drain-source breakdown voltage v br (dss) (t?) drain-source breakdown voltage v br (dss) (25?) 10 8 6 4 2 0 0 0.8 1.6 2.4 3.2 4.0 t c =125? 25? 75? v gs = 0v pulse test
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